Plasmonics, Inc. has many tools and capabilities that come as a direct benefit from being a UCF CREOL affiliate. We have access to many systems and laboratory spaces that allow us to expand our research and development. Scroll down to see a list of capabilities and work spaces.

Facilities

Optoelectronic Fabrication Cleanroom

Class 100, 1,000 and 10,000 Clean Room Facilites

Tools

Software and Simulation Tools

Ansys HFSS Software
High Frequency Structural Simulator (HFSS) is a commercial finite element method solver for electromagnetic structures from Ansys. It can be used for the complex design of RF electronic circuit elements including filters, transmission lines, and packaging.

Solid works software
Solid Works is a solid modeling CAD (computer-aided design) software and is used in market applications like finite element analysis, circuit layout, tolerance checking, among many others.
Matlab software
Matlab is a multi-paradigm numerical computing environment and fourth-generation programming language. MATLAB allows matrix manipulations, plotting of functions and data, implementation of algorithms, creation of user interfaces, and interfacing with programs written in other languages, including C, C++, Java, and Fortran.

Testing Equipment

FTIR

ft-ir-spectrometers-7217-3515861 is a technique which is used to obtain an infrared spectrum of absorption, emission, photoconductivity or Raman scattering of a solid, liquid or gas.
Fourier Transform Infrared Spectroscopy (FTIR) is a technique which is used to obtain an infrared spectrum of absorption, emission, photoconductivity or Raman scattering of a solid, liquid or gas.

NICOLET CONTINUUM FTIR MICROSCOPE

nicolet continum
Used for FT-IR microspectroscopy

SOC-100 HDR

SOC100-3d-300x134
The SOC-100 HDR provides the capabilities to measure the collimated and scattered transmittance of samples, and by using a specular beam blocker, the diffuse and specular partition of the scattered energy.

Lithography and Fabrication Tools

SHUTTLELINE ICP-RIE (UNAXIS III-V ETC.) F

An Inductive Coupled Plasma (ICP) reactor that is used for reactive ion etches. With the ICP, the etching system will be characterized with high plasma density, low process pressure, high etch rate, good etch uniformity, and low energy ion damage. This tool is dedicated to III-V compound semiconductor material etchings.
An Inductive Coupled Plasma (ICP) reactor that is used for reactive ion etches. With the ICP, the etching system will be characterized with high plasma density, low process pressure, high etch rate, good etch uniformity, and low energy ion damage. This tool is dedicated to III-V compound semiconductor material etchings.

LEICA E-BEAM LITHOGRAPHY SYSTEM F

Scans a focused beam of electrons to draw custom shapes on a surface covered with a resist.
Scans a focused beam of electrons to draw custom shapes on a surface covered with a resist.

KARL SUSS UV ALIGNER F

Mask aligner for contact lithography printing.
Mask aligner for contact lithography printing.

RTP 600S ANNEALER F

An advanced benchtop rapid thermal processing system with multi-gas capabilities.
An advanced benchtop rapid thermal processing system with multi-gas capabilities.

PLASMA DE-SCUM F

Used to remove residual photo resist in trenches of wafers.
Used to remove residual photo resist in trenches of wafers.

SI TUBE FURNACE F

Used primarily for wafer processing.
Used primarily for wafer processing.

III-V OXIDATION FURNACE F

Produces a thin layer of oxide (usually silicon dioxide) on the surface of a wafer.
Produces a thin layer of oxide (usually silicon dioxide) on the surface of a wafer.

LEYBOLD DIELECTRIC THIN FILM DEPOSITION F

Leybold dielectric thin film deposition

SPECTROSCOPIC ELLIPSOMETER F

Used for thin film characterization.
Used for thin film characterization.

PLASMA-THERM 790 RIE/PECVD F

A dual-chamber system. The left chamber is for reactive ion etching (RIE), and the right one is for plasma-enhanced chemical vapor deposition (PECVD).
A dual-chamber system. The left chamber is for reactive ion etching (RIE), and the right one is for plasma-enhanced chemical vapor deposition (PECVD).

EDWARDS THERMAL EVAPORATOR F

Edwards thermal evaporator
Uses thermal evaporation, which is one of the most widely used techniques of physical vapor deposition (PVD).

SHARP LMV MILLING MACHINE F

Tool designed to machine metal, wood, and other solid materials.
Tool designed to machine metal, wood, and other solid materials.

LEICA EM UC7/FC7 ULTRAMICROTOMY F 

Ultramicrotomy is a method for cutting specimen into extremely thin slices or sections, that can be viewed in a transmission electron microscope.
Ultramicrotomy is a method for cutting specimen into extremely thin slices or sections, that can be viewed in a transmission electron microscope.

GATAN PECS F

Used for various Scanning Electron Microscopy and Transmission Electron Microscopy applications.
Used for various Scanning Electron Microscopy and Transmission Electron Microscopy applications.

ION MILLING FOR TRANSMISSION ELECTRON MICROSCOPY F

ion milling for tem

ULTRA MICROTOME F

Used for Transmission Electron Microscopy (TEM) and Fourier Transform Infrared Spectroscopy (FTIR) Sample Prep.
Used for Transmission Electron Microscopy (TEM) and Fourier Transform Infrared Spectroscopy (FTIR) Sample Prep.

DIAMOND SAW (LOW SPEED) F

Used for cutting hard or abrasive materials.
Used for cutting hard or abrasive materials.

DIAMOND BAND SAW F

Used for cutting hard or abrasive materials.
Used for cutting hard or abrasive materials.

ELECTRO JET POLISHER F

Used for Transmission Electron Microscopy (TEM) prep.
Used for Transmission Electron Microscopy (TEM) prep.

DIMPLE GRINDER F

Used for rapid material removal with minimal damage (especially for Transmission Electron Microscopy (TEM) preparation).
Used for rapid material removal with minimal damage (especially for Transmission Electron Microscopy (TEM) preparation).

ALLIED POLISHER F

Often used for Transmission Electron Microscopy (TEM) preparation.
Often used for Transmission Electron Microscopy (TEM) preparation.

PATTERN GENERATOR F

For creating laser patterns.
For creating laser patterns.

EVG 620 DUAL SIDED MASK ALIGNER F

Used for wafer alignment.
Used for wafer alignment.

AUTOGLOW PLASMA ASHER F

Removes the photoresist from an etched wafer.
Removes the photoresist from an etched wafer.

NANONEX NEX2500 NANO-IMPRINTER F

Fabricates nanometer scale patterns.
Fabricates nanometer scale patterns.

AJA SIX-GUN SPUTTERING SYSTEM 

Used for film deposition, etching, and analysis.
Used for film deposition, etching, and analysis.

CHA F

An electron beam evaporation tool.
An electron beam evaporation tool.

EVG 510 F

A wafer bonding system.
A wafer bonding system.

J.A. WOOLAM SPECTRAL ELLIPSOMETER F

For thin film analysis
For thin film analysis

RUDOLPH ELLIPSOMETER F

Used for thin film analysis.
Used for thin film analysis.

SIGNATONE 8″ FOUR POINT PROBE F

For resistivity testing.
For resistivity testing.

HP 4145B F

A transistor analyzer.
A transistor analyzer.

HP 4192 LF F

An impedance analyzer.
An impedance analyzer.

DC PROBE STATION F

dc probe station

ISOTEMP PROGRAMMABLE FURNACE F

isotemp programmable furnace

MINI BRUTE FURNACES F

Used for wet and dry silicon oxidation.
Used for wet and dry silicon oxidation.

 

 

Semiconductor

TEMESCAL METALLIZATION SC

Used for compound semiconductor applications.
Used for compound semiconductor applications.

FLIP-CHIP BONDER SC

A precision instrument used to align and bond one or more chips onto a substrate using pressure and/or heat.
A precision instrument used to align and bond one or more chips onto a substrate using pressure and/or heat.

WIRE BONDER SC

wire bonder

WAFER SCRIBER AND CLEAVER SC

Used for semiconductor applications.
Used for semiconductor applications.

SPUTTER DEPOSITION SC

Used extensively in the semiconductor industry to deposit thin films of various materials in integrated circuit processing.
Used extensively in the semiconductor industry to deposit thin films of various materials in integrated circuit processing.

PHYSICAL VAPOR DEPOSITION (PVD) SC

PVD coatings are generally used to improve hardness, wear resistance and oxidation resistance. Thus, such coatings use in a wide range of applications such as: aerospace, automotive, surgical/medical, dies and moulds for material processing, cutting tools, firearms, optics, and thin films.
PVD coatings are generally used to improve hardness, wear resistance and oxidation resistance. Thus, such coatings use in a wide range of applications such as: aerospace, automotive, surgical/medical, dies and moulds for material processing, cutting tools, firearms, optics, and thin films.

CHEMICAL VAPOR DEPOSITION (CVD) SC

Used to produce high-purity, high-performance solid materials. The process is often used in the semiconductor industry to produce thin films.
Used to produce high-purity, high-performance solid materials. The process is often used in the semiconductor industry to produce thin films.

SPUTTER COATER (EMITECH) SC

sputter coater

VACUUM EVAPORATOR (JEOL) SC

A high-vacuum specimen preparation station for both transmission and scanning electron microscopy applications.
A high-vacuum specimen preparation station for both transmission and scanning electron microscopy applications.

EDWARDS FILAMENT EVAPORATOR SC

Used to coat samples with various metals.
Used to coat samples with various metals.

CRYO FILAMENT EVAPORATOR SC

Used to deposit various metals (i.e. gold, silver, chromium, zinc, and others) onto a substrate material like silicon.
Used to deposit various metals (i.e. gold, silver, chromium, zinc, and others) onto a substrate material like silicon.

TEKTRONIX CURVE TRACERS SC

Used for testing a wide variety of power semiconductors.
Used for testing a wide variety of power semiconductors.

 

 

Microscopes and Measurement Tools

VEECO SURFACE PROFILOMETER M&M

Measuring instrument used to measure a surface's profile, in order to quantify its roughness. Can be used for a number of applications including semiconductor, microelectronics, solar, fiber optics, automotive, aerospace, metallurgy, machining, coatings, pharmaceutical, biomedical, and environmental.
Measuring instrument used to measure a surface’s profile, in order to quantify its roughness. Can be used for a number of applications including semiconductor, microelectronics, solar, fiber optics, automotive, aerospace, metallurgy, machining, coatings, pharmaceutical, biomedical, and environmental.

ATOMIC FORCE MICROSCOPE M&M

Very high-resolution type of scanning probe microscopy, with demonstrated resolution on the order of fractions of a nanometer, more than 1000 times better than the optical diffraction limit.
Very high-resolution type of scanning probe microscopy, with demonstrated resolution on the order of fractions of a nanometer, more than 1000 times better than the optical diffraction limit.

OPTICAL MICROSCOPE M&M

optical microscope

TUNGSTEN-FILAMENT SCANNING ELECTRON MICROSCOPE M&M

Type of electron microscope that produces images of a sample by scanning it with a focused beam of electrons. Possible applications are roughness measurement, measurement of fractal dimension, corrosion measurement and step height evaluation.
Type of electron microscope that produces images of a sample by scanning it with a focused beam of electrons. Possible applications are roughness measurement, measurement of fractal dimension, corrosion measurement and step height evaluation.

VARIAN CARY 500 SPECTROPHOTOMETER M&M

Spectrophotometers measure how much a chemical substance absorbs or transmits. Spectrophotometry is widely used for quantitative analysis in various areas (e.g., chemistry, physics, biology, biochemistry, material and chemical engineering, clinical applications, industrial applications, etc).
Spectrophotometers measure how much a chemical substance absorbs or transmits. Spectrophotometry is widely used for quantitative analysis in various areas (e.g., chemistry, physics, biology, biochemistry, material and chemical engineering, clinical applications, industrial applications, etc).

ZYGO NEWVIEW 6300 SCANNING WHITE LIGHT AND OPTICAL PHASE-SHIFTING INTERFEROMETER M&M

a non-contact optical method for surface height measurement on 3-D structures with surface profiles varying between tens of nanometers and a few centimeters.
A non-contact optical method for surface height measurement on 3-D structures with surface profiles varying between tens of nanometers and a few centimeters.

ATOMIC FORCE/SCANNING TUNNELING MICROSCOPE M&M

An instrument for imaging surfaces at the atomic level.
An instrument for imaging surfaces at the atomic level.

SQUID MAGNOMETRY M&M

Measurement instrument used for two general purposes: to measure the magnetization of a magnetic material like a ferromagnet, or to measure the strength and, in some cases, the direction of the magnetic field at a point in space.
Measurement instrument used for two general purposes: to measure the magnetization of a magnetic material like a ferromagnet, or to measure the strength and, in some cases, the direction of the magnetic field at a point in space.

PHOTOELECTRON SPECTROSCOPY M&M

Surface analysis by measuring ejected electrons.
Surface analysis by measuring ejected electrons.

ULTRA HIGH VACUUM SCANNING/TUNNELING MICROSCOPE/ATOMIC FORCE MICROSCOPE M&M

ultra high vacuum scanning tunneling microscope-atomic force microscope

SECONDARY ION MASS SPECTROMETER (SIMS) M&M

Used in materials sciences and surface sciences to analyze the composition of solid surfaces and thin films by sputtering the surface of the specimen with a focused primary ion beam and collecting and analyzing ejected secondary ions.
Used in materials sciences and surface sciences to analyze the composition of solid surfaces and thin films by sputtering the surface of the specimen with a focused primary ion beam and collecting and analyzing ejected secondary ions.

LOW-ENERGY ELECTRON DIFFRACTION (LEED) AND REFLECTION HIGH-ENERGY ELECTRON DIFFRACTION (RHEED) M&M

Used to characterize the surface of crystalline materials.
Used to characterize the surface of crystalline materials.

ATOMIC FORCE MICROSCOPE (AFM)/ MAGNETIC FORCE MICROSCOPE (MFM) M&M

A sharp magnetized tip scans a magnetic sample; the tip-sample magnetic interactions are detected and used to reconstruct the magnetic structure of the sample surface.
A sharp magnetized tip scans a magnetic sample; the tip-sample magnetic interactions are detected and used to reconstruct the magnetic structure of the sample surface.

AUGER MICROSCOPY M&M

An analytical technique that is used to determine the elemental composition of the top few nanometers of all kinds of solid, electrically conductive materials.
An analytical technique that is used to determine the elemental composition of the top few nanometers of all kinds of solid, electrically conductive materials.

SCANNING ELECTRON MICROSCOPE M&M

Produces images of a sample by scanning it with a focused beam of electrons.
Produces images of a sample by scanning it with a focused beam of electrons.

20-INCH RITCHEY-CHRETIEN TELESCOPE M&M

Contains  a high-grade 6-megapixel CCD camera.
Contains a high-grade 6-megapixel CCD camera.

PHYSICAL ELECTRONICS 5400 ESCA (XPS) M&M

Used for surface analysis.
Used for surface analysis.

CAMECA IMS-3F SIMS ION MICROSCOPE M&M

Cameca IMS-3F SIMS ion microscope

PHI ADEPT 1010 DYNAMIC SECONDARY ION MASS SPECTROMETRY (SIMS) SYSTEM M&M

An analytical technique that provides highly sensitive elemental depth profiles of semiconductors and other materials.
An analytical technique that provides highly sensitive elemental depth profiles of semiconductors and other materials.

GENERAL IONIX 1.7 MV TANDETRON RUTHERFORD BACKSCATTERING SPECTROSCOPY RBS M&M

Used for Depth profiling and determining film thickness.
Used for Depth profiling and determining film thickness.

ZEISS ULTRA-55 FEG SCANNING ELECTRON MICROSCOPE (SEM) M&M

Has the ability to perform cutting-edge research on naturally-occurring and fabricated nanostructures across a broad range of disciplines.
Has the ability to perform cutting-edge research on naturally-occurring and fabricated nanostructures across a broad range of disciplines.

JEOL JSM-6480 SCANNING ELECTRON MICROSCOPE (SEM) M&M

jeol jsm-6480 sem

JEOL 733 SUPER PROBE M&M

An SEM, which is optimized for high accuracy in quantitative analysis by EDS and by wavelength dispersive spectroscopy (WDS).
An SEM, which is optimized for high accuracy in quantitative analysis by EDS and by wavelength dispersive spectroscopy (WDS).

FEI TECNAI F30 TRANSMISSION ELECTRON MICROSCOPE (TEM) M&M

fei tecnai f30 tem

JEOL TEM-1011 M&M

A transmission electron microscope.
A transmission electron microscope.

FEI 200 TEM FIB M&M

A transmission electron microscope.
A transmission electron microscope.

OLYMPUS LEXT OLS 3000 M&M

A Confocal Laser Scanning Microscope (CSM)
A Confocal Laser Scanning Microscope (CSM)

RENISHAW RM 1000B MICRO-RAMAN SPECTROMETER M&M

A spectroscopic technique used to observe vibrational, rotational, and other low-frequency modes in a system. Often used to study changes in chemical bonding.
A spectroscopic technique used to observe vibrational, rotational, and other low-frequency modes in a system. Often used to study changes in chemical bonding.

VEECO-INTERFEROMETRIC PROFILER M&M

Used for surface profiling.
Used for surface profiling.

ALPHA STEP PROFILOMETER M&M

Measures the 2D typography of surfaces.
Measures the 2D typography of surfaces.

NIKON MEASUREMENT MICROSCOPE M&M

nikon measurements microscope

NIKON INSPECTION MICROSCOPE M&M

nikon inspection microscpoe

MICRO POSITIONER

micro positioner

 

 

Imaging

X-RAY IMAGING I

x-ray imaging

FAR INFRARED LASERS I

A laser with output wavelength in far infrared part of the electromagnetic spectrum.
A laser with output wavelength in far infrared part of the electromagnetic spectrum.

RIGAKU D/MAX XRD II I

Used for X-ray diffraction.
Used for X-ray diffraction.

ZEISS 1540 CROSSBEAM I

Focused ion and electron beam instrument.
Focused ion and electron beam instrument.

FLIR INFRARED CAMERA

Infrared cameras form an image using infrared radiation, similar to a common camera that forms an image using visible light. It can be used for night vision, security purposes, thermography, and chemical imaging.
Infrared cameras form an image using infrared radiation, similar to a common camera that forms an image using visible light. It can be used for night vision, security purposes, thermography, and chemical imaging.

 

Electronic Capabilities

CIRCUIT DESIGN AND FABRICATION

 

We have the capacity to create custom circuits for customers. For more information on our services in this area, please visit our “Get in Touch” page.